RE[designed, fabricated, assembled, tested] Expensive and time consuming Design for Reliability = Solution Microsystems Packaging 5.2 Microsystems Failures and Failure Mechanisms High-level symptoms (i.e. computer, TV) Underlying cause (i.e. chip, corrosion, moisture, electrostatic discharge) – PRODUCT NOT RELIABLE Design for Reliability understands, identifies, and prevents such failures Overstress Mechanisms – stress exceeds the strength or capacity of the component and causes the…
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